发明名称 Semiconductor device and method of manufacturing the same
摘要 A semiconductor device and method of fabricating the same. The semiconductor device includes at least one first contact pin on a first substrate and at least one second contact pin on a second substrate. The at least one first and second contact pins may be included in first and second contact pin arrays. The first and second contact pins of the first and second contact pin arrays may be aligned.
申请公布号 US7850087(B2) 申请公布日期 2010.12.14
申请号 US20050176326 申请日期 2005.07.08
申请人 SAMSUNG ELECTRONICS CO. LTD. 发明人 HWANG YI-SUNG;CHO SUNG-DAE
分类号 G06K19/06;G06K19/00 主分类号 G06K19/06
代理机构 代理人
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