发明名称 |
Methods and apparatuses for improved positioning in a probing system |
摘要 |
An improved method and apparatus for automatically and accurately aligning a wafer prober to the bonding pads of a semiconductor device are provided. In one embodiment of one aspect of the invention, a multi-loop feedback control system incorporating information from a number of sensors is used to maintain the desired contact position in the presence of disturbances. Other aspects and other embodiments are also described.
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申请公布号 |
US7852097(B2) |
申请公布日期 |
2010.12.14 |
申请号 |
US20080042294 |
申请日期 |
2008.03.04 |
申请人 |
NAYAK UDAY;ZHANG XIAOLAN;ASMEROM GEORGE;JEDDA MAX |
发明人 |
NAYAK UDAY;ZHANG XIAOLAN;ASMEROM GEORGE;JEDDA MAX |
分类号 |
G01R31/02 |
主分类号 |
G01R31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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