发明名称 HIGH POWER LASER PACKAGE WITH VAPOR CHAMBER
摘要 A heat spreader structure includes a high power laser with an epi side and an emitting facet. A vapor chamber includes a housing defining an inner vapor cavity and a wick positioned in the vapor cavity to define an evaporation area on one side of the cavity, a condensation area on an opposite side of the cavity, and fluid communication between the condensation area and the evaporation area. A space defined between the evaporation area and the condensation area. The wick includes a porous powder sintered to inner surfaces of the sealed cavity to hold the porous powder in position. The epi side of the laser is coupled to the one side of the vapor chamber and heat removal mechanism is coupled to the opposite side of the cavity.
申请公布号 US2010309940(A1) 申请公布日期 2010.12.09
申请号 US20090478190 申请日期 2009.06.04
申请人 LEE HSING-CHUNG 发明人 LEE HSING-CHUNG
分类号 H01S3/04;F28D15/04;F28F7/00;H05K7/20 主分类号 H01S3/04
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