ENCAPSULATION PROCESS AND STRUCTURE FOR ELECTRONIC DEVICES

摘要

Electronic devices, such as photovoltaic, transistor or doped light-emitting devices, can be manufactured with an air-based manufacturing process and device structure that encapsulates the device with air-stable electrodes and active layers that are reasonably stable in their unexcited state. A sheet of flexible material may act as a substrate and a second sheet of material acts as a cover. Getter materials are included in the encapsulated device, with the getter latent or unreactive during the manufacturing process.