| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of processing a wafer, in which the wafer can be accurately divided along streets and the thickness of divided devices can be formed to a thin thickness. SOLUTION: The method, which divides the wafer 2 into the individual device along the streets, includes the processes of: forming division grooves of depth corresponding to a finish thickness of the devices along the streets from a surface side of the wafer; sticking the wafer, which has the division grooves formed on a rigid plate 4 having a plurality of through-holes formed in a wafer sticking region, with an adhesive resin 40; curing the adhesive resin by irradiation 5 with ultraviolet rays to increase the adhesive power; grinding the wafer reverse surface up to the division grooves to divide the wafer into the individual device; sticking the reverse surface of the wafer to an adhesive tape; causing the wafer and adhesive resin to swell, by dipping the wafer and rigid plate into hot water, to decrease the holding power of the adhesive resin; and peeling the rigid plate from the surface of the wafer. COPYRIGHT: (C)2011,JPO&INPIT |
