发明名称 SPHERICAL SURFACE ACOUSTIC WAVE MODULE
摘要 PROBLEM TO BE SOLVED: To provide a spherical surface acoustic wave (SAW) module for suppressing the loss of SAW in a matching circuit. SOLUTION: A spherical SAW module includes: a spherical SAW element 11 including a three-dimensional substrate 13 for defining an arcuate band 12, that is a part of a circumferential band of a spherical surface, and an electro-acoustic transducer 15 provided on the arcuate band 12 for exciting a SAW 14 along the arcuate band 12; and a matching circuit 20 connected to the spherical SAW element 11. A reflection loss in an input terminal of the matching circuit 20 is increased so as to decrease a loss of the SAW 14 in the matching circuit 20. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010278863(A) 申请公布日期 2010.12.09
申请号 JP20090130435 申请日期 2009.05.29
申请人 TOPPAN PRINTING CO LTD 发明人 YANAGISAWA YASUYUKI
分类号 H03H9/25 主分类号 H03H9/25
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