发明名称 EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an epoxy resin composition capable of giving a cured material having excellent fire retardancy and heat resistance. SOLUTION: The epoxy resin composition contains an epoxy resin obtained by reacting a specific phenolphthalein based compound with epihalohydrin, a phenyl aralkyl type epoxy resin, a phenol resin expressed by formula (2) and metallic hydroxide filler, (in the formula, R independently exists and expresses one of hydrogen atom, a 1-10C alkyl group or aryl group and (n) is the average number of repetitions and expresses 1<n≤5). COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010275479(A) 申请公布日期 2010.12.09
申请号 JP20090130925 申请日期 2009.05.29
申请人 NIPPON KAYAKU CO LTD 发明人 KAWAI KOICHI;SUNAGA TAKAO;NAKANISHI MASATAKA;OSHIMI KATSUHIKO
分类号 C08G59/26;C08G59/62;C08K3/22;C08L63/00;H01L23/29;H01L23/31 主分类号 C08G59/26
代理机构 代理人
主权项
地址