| 发明名称 |
INDIUM-CONTAINING LEAD-FREE SOLDER FOR VEHICLE-MOUNTED ELECTRONIC CIRCUITS |
| 摘要 |
A lead-free solder alloy which can be used for soldering of vehicle-mounted electronic circuits and which exhibits high reliability is provided. The alloy consists essentially of Ag: 2.8-4 mass %, In: 3-5.5 mass %, Cu: 0.5-1.1 mass %, if necessary Bi: 0.5-3 mass %, and a remainder of Sn. In is at least partially in solid solution in the Sn matrix.
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| 申请公布号 |
US2010307823(A1) |
申请公布日期 |
2010.12.09 |
| 申请号 |
US20080452665 |
申请日期 |
2008.07.17 |
| 申请人 |
KAWAMATA YUJI;UESHIMA MINORU;TAMURA TOMU;MATSUSHITA KAZUHIRO;SAKAMOTO MASASHI |
发明人 |
KAWAMATA YUJI;UESHIMA MINORU;TAMURA TOMU;MATSUSHITA KAZUHIRO;SAKAMOTO MASASHI |
| 分类号 |
H01R4/02;B23K1/00;C22C13/02 |
主分类号 |
H01R4/02 |
| 代理机构 |
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