| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device capable of obviating the need of a troublesome process accompanying a heat treatment, and applicable to a multilayer printed wiring board. <P>SOLUTION: This method of manufacturing a semiconductor device includes at least: a process A of applying a first resin (insulation resin) 4a to cover one surface of a semiconductor substrate 2 with electrodes 3 formed on the one surface; a process B of pressing an uneven surface of a mold die 10 having unevenness against a first resin application surface after the application of the first resin, and forming a projecting part region made of the first resin and a recessed part region for exposing the electrodes; and a process C of curing the first resin while pressing the mold die, and forming a first opening 5 by the recessed part region and a first resin layer (insulation resin layer) 4 by the projecting part region. <P>COPYRIGHT: (C)2011,JPO&INPIT |
