发明名称 ELASTIC WAVE DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an elastic wave device in which a hollow space has high liquid hermeticity by preventing flux from flowing into the inside of the hollow space when solder bumps are used for mounting. SOLUTION: This elastic wave device is provided with: a substrate 11; a vibrating section 14 formed on one main surface 11a of the substrate 11; a pad 13 electrically connected to electrodes 12 of the vibrating section 14; a supporting layer 20 provided so as to surround the vibrating section 14, having a width of 10-100μm and containing a photosensitive polyimide as a main component; a sheet-like cover layer 22 provided on the supporting layer 20 so as to cover the vibrating section 14, forming a hollow space 19 around the vibrating section 14 and containing at least a synthetic rubber and a resin; a protective layer 24 made of resin having flux resistance; a via conductor 16 penetrating through the protective layer 24, the cover layer 22 and the supporting layer 20 and connected to the pad 13; and external electrodes 18 provided on the end of the protective layer 24 side of the via conductor 16 and made of a solder bump. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010278972(A) 申请公布日期 2010.12.09
申请号 JP20090132195 申请日期 2009.06.01
申请人 MURATA MFG CO LTD 发明人 KAKUI ATSUSHI;TAKADA TADAHIKO
分类号 H03H9/25;H01L41/09;H03H9/17;H03H9/54;H03H9/64;H03H9/70;H03H9/72 主分类号 H03H9/25
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