发明名称 |
BONDING METHOD AND BONDED BODY |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a bonding method for tightly bonding two base materials to each other with high dimensional accuracy at low temperature with high efficiency; and a bonded body bonded by the same. <P>SOLUTION: The bonding method includes the steps of: preparing a first base material 21 and a second base material 22; supplying a liquid material 35 containing a polyester-modified silicone material to at least one of the first base material 21 and the second base material 22 so as to form a liquid film 30; drying and/or curing the liquid film 30 so as to obtain a bonding film 3 on at least one of the first base material 21 and the second base material 22; applying energy to the bonding film 3 so as to develop adhesiveness around a surface 32 of the bonding film 3; and bringing the first base material 21 and the second base material 22 into contact with each other in a manner to interpose the bonding film 3 on which adhesiveness is developed therebetween so as to obtain a bonded body 1 in which the first base material 21 and the second base material 22 are bonded to each other with the bonding film 3 interposed therebetween. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
申请公布号 |
JP2010275422(A) |
申请公布日期 |
2010.12.09 |
申请号 |
JP20090129182 |
申请日期 |
2009.05.28 |
申请人 |
SEIKO EPSON CORP |
发明人 |
SATO MITSURU;YAMAMOTO TAKATOMO;NAITO NOBUHIRO;IMAMURA MINEHIRO |
分类号 |
C09J5/00;B29C65/52;B41J2/16;C09J183/06 |
主分类号 |
C09J5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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