发明名称 BONDING METHOD AND BONDED BODY
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a bonding method for tightly bonding two base materials to each other with high dimensional accuracy at low temperature with high efficiency; and a bonded body bonded by the same. <P>SOLUTION: The bonding method includes the steps of: preparing a first base material 21 and a second base material 22; supplying a liquid material 35 containing a polyester-modified silicone material to at least one of the first base material 21 and the second base material 22 so as to form a liquid film 30; drying and/or curing the liquid film 30 so as to obtain a bonding film 3 on at least one of the first base material 21 and the second base material 22; applying energy to the bonding film 3 so as to develop adhesiveness around a surface 32 of the bonding film 3; and bringing the first base material 21 and the second base material 22 into contact with each other in a manner to interpose the bonding film 3 on which adhesiveness is developed therebetween so as to obtain a bonded body 1 in which the first base material 21 and the second base material 22 are bonded to each other with the bonding film 3 interposed therebetween. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2010275422(A) 申请公布日期 2010.12.09
申请号 JP20090129182 申请日期 2009.05.28
申请人 SEIKO EPSON CORP 发明人 SATO MITSURU;YAMAMOTO TAKATOMO;NAITO NOBUHIRO;IMAMURA MINEHIRO
分类号 C09J5/00;B29C65/52;B41J2/16;C09J183/06 主分类号 C09J5/00
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