| 摘要 |
A carrier structure for mounting at least an LED chip includes at least a lead and a base. The LED chip housed inside the base is coupled parallel with an electronic element. The lead is connected electrically to the LED chip at one end, while another end is exposed to the atmosphere. The base encaving the lead further has a shallow accommodation room to mount the electronic element at a surface not the same with the surface that mounts the LED chip.
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