发明名称 |
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, DISPLAY DEVICE, AND ELECTRONIC INSTRUMENT |
摘要 |
A method of manufacturing a semiconductor device includes: forming a plurality of regions extending in a predetermined direction on a substrate; and ejecting a liquid material on the plurality of regions to form an electrically conductive film, wherein the electrically conductive film extends in the same direction as the plurality of regions so as to overlap the plurality of regions.
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申请公布号 |
US2010308318(A1) |
申请公布日期 |
2010.12.09 |
申请号 |
US20100858081 |
申请日期 |
2010.08.17 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
KAWASE TAKEO;SAKAI SHINRI |
分类号 |
H01L51/10 |
主分类号 |
H01L51/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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