发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, DISPLAY DEVICE, AND ELECTRONIC INSTRUMENT
摘要 A method of manufacturing a semiconductor device includes: forming a plurality of regions extending in a predetermined direction on a substrate; and ejecting a liquid material on the plurality of regions to form an electrically conductive film, wherein the electrically conductive film extends in the same direction as the plurality of regions so as to overlap the plurality of regions.
申请公布号 US2010308318(A1) 申请公布日期 2010.12.09
申请号 US20100858081 申请日期 2010.08.17
申请人 SEIKO EPSON CORPORATION 发明人 KAWASE TAKEO;SAKAI SHINRI
分类号 H01L51/10 主分类号 H01L51/10
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