COMPOSITION FOR CONDUCTIVE PASTE CONTAINING NANOMETER-THICK METAL MICROPLATES

摘要

Disclosed is a composition for a conductive paste containing micrometer- size plate-shaped metal particles having a thickness of 200 nm or less. The composition comprises silver nano particles having an average particle size between 1 nm to 100 nm; and plate-shaped metal particles. Preferably, the micrometer-size plate-shaped metal particles have an average thickness of 200 nm or less. Preferably, the micrometer- size plate-shaped metal particles have horizontal and vertical sides of 1 to 20 µm size on average. The composition may further comprise metal nano particles such as copper, palladium and so on. And, the composition may further comprise carbon nanotubes, and the surface of the carbon nanotubes may be coated with metal nano particles. The use of such composition can reduce a sintering temperature to a low temperature of 150 °C or lower and decrease the thickness of a circuit wire for achieving the same resistance.