| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component high in shielding function, and to provide a circuit module including the same. <P>SOLUTION: In this electronic component 100, an electric element 11 is mounted on a principal surface 10S of a substrate 10, and a fixed potential electrode 12 is formed on the principal surface 10S of the substrate 10. A sealing layer 13 is formed on the principal surface of the substrate to seal the electric element 11. A conductive layer 14 is formed on principal surface and the sealing layer 13, and covers the sealing layer 13 to be sealed. The conductive layer is electrically connected to the fixed potential electrode. <P>COPYRIGHT: (C)2011,JPO&INPIT |
