| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of solving a problem that there is no inspection method for checking a state of a cut surface after scribing and dividing the semiconductor device into individual pieces. SOLUTION: In the semiconductor device, a sealing ring layer 5 is arranged on an outer circumference of a device forming region W1 on a silicon substrate, and a positional accuracy confirming mark 14 is formed from the device forming region W1 above the sealing ring layer 5 to the side of a scribe region W2. According to this structure, the positional accuracy confirming mark 14 is exposed on the cut surface of the semiconductor device 1 and a quality check for the cut surface can be made by using the exposed shape. COPYRIGHT: (C)2011,JPO&INPIT |
