| 摘要 |
A multi-chip hybrid-mounted device is provided that is fabricated by an extremely simple fabrication process, thereby enabling excellent reliability and yield. During the mounting process, the submount is kept at a bias temperature slightly below the solder melting point. For each chip to be mounted, an auxiliary heater element located adjacent to the actual mounting/soldering position is temporarily energized. Using a bias temperature, a local temperature increase of only a few degrees Celsius in the mounting/soldering area will initiate the soldering process and affix the chip. Such a small temperature increase is readily achieved by the laterally displaced heater element with only a minimal amount of thermal stress. The fabrication process is fully scalable and enables mounting of an arbitrarily large number of chips using only a single solder material.
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