发明名称 SIDE-VIEW LIGHT EMITTING DIODE PACKAGE HAVING A REFLECTOR
摘要 Disclosed herein is a side-view light emitting diode package with a reflector. The side-view light emitting diode package of the present invention comprises first and second lead terminals spaced apart from each other. The package body supports the first and second lead terminals and has an elongated opening through which a light emitting diode chip mounting region and the first and second lead terminals are exposed. Reflectors are formed between the chip mounting region and sidewalls positioned in a major axis direction of the opening. Each of the reflectors has a height lower than that of the sidewall of the opening. Accordingly, light emitted from a light emitting diode chip can be reflected using the reflectors, thereby improving light emitting efficiency of the side-view light emitting diode package.
申请公布号 US2010308364(A1) 申请公布日期 2010.12.09
申请号 US20100833698 申请日期 2010.07.09
申请人 SEOUL SEMICONDUCTOR CO., LTD. 发明人 BUKESOV SERGEY
分类号 H01L33/48;H01L33/60 主分类号 H01L33/48
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