| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an imaging module which improves heat dissipation efficiency and is miniaturized. <P>SOLUTION: The imaging module 1 includes a case 5, an imaging element 2 housed inside the case 5, and a transparent heat sink 6 installed by holding the outer peripheral part on the inner surface of the case 5 and abutting the main surface to the surface on the object side of the imaging element 2. Heat generated in the imaging element 2 is excellently transmitted to the transparent heat sink 6 abutted to the surface on the object side of the imaging element 2. Then, the heat transmitted from the imaging element 2 to the transparent heat sink 6 is excellently transmitted to the case 5 holding the outer peripheral part of the transparent heat sink 6. As a result, the heat generated in the imaging element 2 is efficiently dissipated to the outside of the imaging module 1. <P>COPYRIGHT: (C)2011,JPO&INPIT |
