ELECTRONIC COMPONENT PACKAGE, AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an electronic component package capable of suppressing dust generation in an atmosphere high in cleanliness even when using an easily-dust-generating board, and to provide a method of manufacturing the same.

SOLUTION: This electronic component package includes: a circuit board 1 having a pair of principal surfaces and end faces; a capacitance type humidity sensor mounted on one-side principal surface of the circuit board 1; a sealing resin 2 for sealing the capacitance type humidity sensor on the one-side principal surface other than the end faces of the easily-dust-generating board; and an end face protective layer 8 for covering at least the end face of the circuit board 1.

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