| 摘要 |
PROBLEM TO BE SOLVED: To provide a test device for a semiconductor device capable of carrying out a test, while any one of two or more semiconductor devices is pressed onto a contactor from the back side, and to provide a test method. SOLUTION: The two or more semiconductor devices 20 are aligned on a support substrate 21 and held. The support substrate 21 is placed and fixed on a stage 22 having a space opened toward the contactor 24 inside. A pressing head 25 is arranged in a space inside the stage 22. The support substrate 21 has recessed parts for exposing respective back faces 20b of the two or more semiconductor devices 20 toward the space of the stage 22 and holding them. The stage 22 can be moved in the horizontal direction, and the pressing head 25 can be moved in the vertical direction. The pressing head 25 has a pressing surface 25a for pressing a semiconductor device to be tested, and positioning guides 25b for arranging the semiconductor device to be tested at a predetermined position in the recessed part. COPYRIGHT: (C)2011,JPO&INPIT
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