HEAT DISSIPATION DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

A heat dissipation device includes a heat sink, a heat-absorbing plate with two slots defined in two lateral sides thereof, a heat pipe connecting the heat-absorbing plate and the heat sink, and a clip having an abutting portion and two locking portions extending from two ends of the abutting portion. The abutting portion presses on the heat pipe, and the locking portions insert through the slots of the heat-absorbing plate and are then bent to lock on the heat-absorbing plate to thereby secure the heat pipe on the heat-absorbing plate.