发明名称 |
SUPPORT PLATE, METHOD FOR PRODUCING THE SAME, AND METHOD FOR PROCESSING SUBSTRATE |
摘要 |
This invention provides a support plate which makes it possible to stably perform a step for separating from a support plate a wafer which has been processed while preventing delay in time taken for this step. The support plate of this invention is a support plate for supporting a substrate via an adhesive, including: a plate-shaped part having a surface which is in contact with the adhesive; and at least one spacer provided on the surface which is in contact with the adhesive.
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申请公布号 |
US2010310817(A1) |
申请公布日期 |
2010.12.09 |
申请号 |
US20100794096 |
申请日期 |
2010.06.04 |
申请人 |
IMAI HIROFUMI;TAMURA KOKI;ASAI TAKAHIRO;YOSHIOKA TAKAHIRO;INAO YOSHIHIRO |
发明人 |
IMAI HIROFUMI;TAMURA KOKI;ASAI TAKAHIRO;YOSHIOKA TAKAHIRO;INAO YOSHIHIRO |
分类号 |
B32B3/02;B32B37/00;G03F7/20 |
主分类号 |
B32B3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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