发明名称 WIRING BOARD AND STRUCTURE FOR MOUNTING ELECTRONIC COMPONENT USING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a wiring board that can suppress the positional deviation of first and second electronic components having bottom electrodes of different sizes when soldering them on one and the same wiring board and can manage a change in design without increasing mounting steps of the first and second electronic components, and also to provide a structure for mounting electronic components using the same. <P>SOLUTION: Each land 11 has a first region 12 and a second region 13 and is also provided with a damming means 15 between the first and second regions 12 and 13. A length in a second direction of the land 11 is the same as a length in a second direction of a first bottom electrode 21, and a length in a second direction of the first region 12 is the same as a length in a second direction of a second bottom electrode 31. A length in a first direction between the two lands 11 is the same as the length in the first direction between the first and second bottom electrodes 21 and 31. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2010278213(A) 申请公布日期 2010.12.09
申请号 JP20090129022 申请日期 2009.05.28
申请人 DENSO CORP 发明人 HAYASE YOICHI;KAMIYA KIYOSHI;SAKUTA TAKUYA;KUSANO TATSUKI;MUROWAKI TORU
分类号 H05K3/34;H01L23/12 主分类号 H05K3/34
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