发明名称 SILVER-COATED COPPER POWDER AND CONDUCTIVE PASTE
摘要 PROBLEM TO BE SOLVED: To provide silver-coated copper powder of high quality suitable to a filler for conductive paste, and to provide conductive paste using the same. SOLUTION: The silver-coated copper powder comprises a silver-coated layer on the surface of flake-shaped copper powder which is mechanically flattened, and whose lightness L* prescribed in JIS Z8729 is≥50. In the silver-coated copper powder, a silver-coated layer is provided on the surface of the flake-shaped copper powder which is mechanically flattened, and the average thickness t (nm) of the silver-coated layer, and the lightness L* of the silver-coated copper powder satisfy the relation in inequality; 39+0.76t-3.5×10<SP>-3</SP>t<SP>2</SP>≤L*. The coating weight of silver is, e.g.,≤30 mass%. The coating weight of oxygen is, e.g.,≤1 mass%, and the content of carbon is, e.g.,≤2 mass%. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010275638(A) 申请公布日期 2010.12.09
申请号 JP20100157535 申请日期 2010.07.12
申请人 DOWA HOLDINGS CO LTD 发明人 HIRATA AKITSUGU;YAMASHINA HIROYUKI;HARANO JUNJI
分类号 B22F1/02;B22F1/00;C23C18/42;H01B1/00;H01B1/22;H01B5/00 主分类号 B22F1/02
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