发明名称 |
METHOD FOR FORMING SILICON CARBIDE FILM |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a silicon carbide film capable of making a silicon carbide device and a silicon device coexist on a single chip without etching a silicon carbide film having difficulty in etching. SOLUTION: This method for forming the silicon carbide film 13 includes: a step for forming a mask 15a at a position covering a part of a silicon film 14 on a substrate 11 having the silicon film 14 on a surface layer, and a step for applying carbonizing treatment to the silicon film 14 of a region where the mask 15a is not formed to form the silicon carbide film 13 containing the carbonized film. COPYRIGHT: (C)2011,JPO&INPIT
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申请公布号 |
JP2010278210(A) |
申请公布日期 |
2010.12.09 |
申请号 |
JP20090129018 |
申请日期 |
2009.05.28 |
申请人 |
SEIKO EPSON CORP;KYUSHU INSTITUTE OF TECHNOLOGY |
发明人 |
MATSUO HIROYUKI;NAKAO MOTOI |
分类号 |
H01L21/20;H01L21/336;H01L29/786 |
主分类号 |
H01L21/20 |
代理机构 |
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地址 |
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