发明名称 METHOD FOR FORMING SILICON CARBIDE FILM
摘要 PROBLEM TO BE SOLVED: To provide a method for forming a silicon carbide film capable of making a silicon carbide device and a silicon device coexist on a single chip without etching a silicon carbide film having difficulty in etching. SOLUTION: This method for forming the silicon carbide film 13 includes: a step for forming a mask 15a at a position covering a part of a silicon film 14 on a substrate 11 having the silicon film 14 on a surface layer, and a step for applying carbonizing treatment to the silicon film 14 of a region where the mask 15a is not formed to form the silicon carbide film 13 containing the carbonized film. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010278210(A) 申请公布日期 2010.12.09
申请号 JP20090129018 申请日期 2009.05.28
申请人 SEIKO EPSON CORP;KYUSHU INSTITUTE OF TECHNOLOGY 发明人 MATSUO HIROYUKI;NAKAO MOTOI
分类号 H01L21/20;H01L21/336;H01L29/786 主分类号 H01L21/20
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