| 摘要 |
PROBLEM TO BE SOLVED: To provide a both-surface wiring circuit board having high connection reliability of wiring patterns on both surfaces, and a method of manufacturing the same. SOLUTION: A wiring pattern 20 is formed on a lower surface of an insulating layer 10 via an intermediate layer 5. Further, a plurality of hole parts 150 reaching the wiring pattern are formed in the insulating layer 10. A wiring pattern 50 comprising a laminate structure of a seed layer 30 and an electrolytic plating layer 40 is formed on an upper surface of the insulating layer 10, and an inner peripheral surface and a bottom surface of each hole part 150. The wiring pattern 50 includes a wiring part 50a and a land 50b. The oxygen element ratio integrated value of a surface of the wiring pattern 20 on the bottom surface of the hole part 150 is set to 120 to 530%. COPYRIGHT: (C)2011,JPO&INPIT
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