Forming, between a supporting substrate and the bottom conductive layer of a stack of layers a plurality of electronically functional elements, a non-conducting layer that functions to increase the adhesion of said bottom conductive layer to the supporting substrate.
申请公布号
WO2010139802(A1)
申请公布日期
2010.12.09
申请号
WO2010EP57863
申请日期
2010.06.04
申请人
PLASTIC LOGIC LIMITED;JOIMEL, JEROME;RAMSDALE, CATHERINE;PLACIDO, FRANK
