发明名称 ELECTRONIC COMPONENT MOUNTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To shape a suction hole of a suction nozzle so that a suction error does not occur as much as possible. <P>SOLUTION: The external shape of a suction surface of the suction nozzle 5 is sized to be a little smaller than the external shape of a suction surface of an electronic component D, such that the whole electronic component D is not covered. The suction hole 11 at the distal end of the suction nozzle 5 is shaped such that a large-diameter circular hole 11A at a center part communicates with small-diameter circular holes 11B (smaller in opening area than the circular hole 11A) on both sides adjacent to the large-diameter circular hole 11A. Further, the hole 11A and the holes 11B communicate with each other in such a state wherein the length L2 between communication parts of the small-diameter circular holes 11B is shorter than the diameter of the circular hole 11B, namely, the large-diameter circular hole 11A and small-diameter circular holes 11B communicate with each other by forming projection parts 11C narrowing down hole widths so that the circular holes 11B are in an arcuate shape of &ge;180&deg;. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010278268(A) 申请公布日期 2010.12.09
申请号 JP20090129721 申请日期 2009.05.28
申请人 HITACHI HIGH-TECH INSTRUMENTS CO LTD 发明人 YAMAGUCHI MASAKI;YAMAGUCHI HARUHIKO;KASHIWATANI NAOKATSU;FUKUSHIMA YOSHIHARU;SETO KATSUYUKI
分类号 H05K13/04 主分类号 H05K13/04
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