| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a ceramic package for storing an semiconductor light receiving element that can have an outer-side lead tip portion formed in an I, L or J shape even when including a ceramic base with a narrow bank part width and being thin in thickness. <P>SOLUTION: The ceramic package 10 for storing the semiconductor light receiving element includes the quadrangular ceramic base 11 provided at its outer peripheral part with the bank part 15 forming a cavity part 14 for storing the semiconductor light receiving element 13, and a plurality of lead terminals 12 each having an out-side lead tip part 17 and an inner-side lead tip part 18 extended on both sides of a lead intermediate part 16 while joined to the ceramic base 11, wherein the lead terminal 12 has the outer-side lead tip part 17 projecting from an upper surface of the bank part 15, the lead intermediate part 16 coming into contact with an inner peripheral side wall surface of the bank part 15 from the upper surface of the bank part 15, and the inner-side lead tip part 18 coming into contact with a bottom surface of the cavity part 14. <P>COPYRIGHT: (C)2011,JPO&INPIT |
