| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC socket in which mechanical connection stability with other substrate is secured, and a low inductance in a coil spring is achieved. SOLUTION: The IC socket is provided with: a plurality of coil springs 10 having a coil part 13 and one end 11 and the other end 12 projecting from the coil part 13; an insulating substrate of two sheets of flat plate which has a plurality of through holes 23 to insert the coil spring 10 individually and is arranged superimposed; and a fixing member 31 which positions the insulating substrates 20. A projection part 23a projecting from the inner side face of the through holes 23 is formed in at least one of the through holes 23 of the insulating substrate 20, this projection part 23a is arranged in a cavity in an axial direction of the coil part 13, the coil part 13 is fixed by pressing in the axial direction by the inner side face of the through hole 23 of each insulating substrate 21, 22, and the one end 11 and the other end 12 of the coil spring 10 are arranged projecting to one end side and the other end side of the insulating substrate 20, respectively. COPYRIGHT: (C)2011,JPO&INPIT
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