发明名称 |
MANUFACTURING METHOD THEREOF AND A SEMICONDUCTOR DEVICE |
摘要 |
In a semiconductor device, a lead frame made of a copper alloy prevents exfoliation occurring near the surface of the lead frame. A copper oxide layer is formed on the base material made of a copper alloy by immersing the base material into a solution of a strong oxidizer. The copper oxide layer serves as an outermost layer and consists of a copper oxide other than a copper oxide in the form of needle crystals.
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申请公布号 |
US2010310781(A1) |
申请公布日期 |
2010.12.09 |
申请号 |
US20100856730 |
申请日期 |
2010.08.16 |
申请人 |
FUJITSU SEMICONDUCTOR LIMITED |
发明人 |
YURINO TAKAHIRO |
分类号 |
B05D5/12;H01L23/50;H01L23/31;H01L23/495 |
主分类号 |
B05D5/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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