发明名称 MANUFACTURING METHOD THEREOF AND A SEMICONDUCTOR DEVICE
摘要 In a semiconductor device, a lead frame made of a copper alloy prevents exfoliation occurring near the surface of the lead frame. A copper oxide layer is formed on the base material made of a copper alloy by immersing the base material into a solution of a strong oxidizer. The copper oxide layer serves as an outermost layer and consists of a copper oxide other than a copper oxide in the form of needle crystals.
申请公布号 US2010310781(A1) 申请公布日期 2010.12.09
申请号 US20100856730 申请日期 2010.08.16
申请人 FUJITSU SEMICONDUCTOR LIMITED 发明人 YURINO TAKAHIRO
分类号 B05D5/12;H01L23/50;H01L23/31;H01L23/495 主分类号 B05D5/12
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