| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce stress because of a difference of a thermal expansion coefficient between a semiconductor chip and a wiring board and stresses applied to an external terminal which improves the reliabilities of a semiconductor device and of secondary mounting, and to reduce warpage of the semiconductor device so as to suppress the occurrence of deterioration in mounting accuracy and defective connections of solder balls. <P>SOLUTION: A method for manufacturing a semiconductor device adopts a step in which a wiring board 1, having through-holes 8a, and a support substrate provided with chip support parts protruding from one face of the support substrate are stacked on one another and the chip support parts are inserted into the through-holes so as to protrude the tips of the chip support parts from one face of the wiring board; a step for placing semiconductor chips 9 on the tips of the chip support parts; a step for forming a first sealing resin 12, covering the semiconductor chips on the one face of the wiring board; and a step in which the through-hole opened by removing the support substrate are filled with a second sealing resin 13 and makes the second sealing resin integrated with the first sealing resin. <P>COPYRIGHT: (C)2011,JPO&INPIT |
