发明名称 SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor memory device that can surely prevent a capacity insulation film, made of ferroelectric or high dielectric in a capacitor from being deteriorated by hydrogen generating from a hydrogen barrier film, and to provide a manufacturing method for the device. SOLUTION: The semiconductor memory device includes a capacitor 20, that is formed on a semiconductor substrate 11 and is provided with a capacity insulation film 18 made of ferroelectric or high dielectric, and a first hydrogen barrier film 15 formed under the capacitor 20. The first hydrogen barrier film 15 is made of silicon nitride containing fluorine. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010278197(A) 申请公布日期 2010.12.09
申请号 JP20090128742 申请日期 2009.05.28
申请人 PANASONIC CORP 发明人 TATSUNARI TOSHITAKA
分类号 H01L27/105;C23C16/42;H01L21/318;H01L21/8242;H01L21/8246;H01L27/108 主分类号 H01L27/105
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