发明名称 ELECTRONIC COMPONENT, ELECTRONIC COMPONENT DEVICE USING THE SAME AND METHOD OF MANUFACTURING THEM
摘要 PROBLEM TO BE SOLVED: To provide an electronic component with high connection reliability and electrical conductivity, even when a metal nanoparticle layer in a metal nanoparticle junction is thin, and to provide an electronic component device which uses the component and a method of manufacturing them. SOLUTION: In the electronic component including a base body, a first electrode formed on the base body, a wall formed on the surface of the base body and formed so as to be in contact with at least one of the side face and upper surface of the first electrode and to surround the periphery of the first electrode, and a second electrode bonded on the first electrode, the second electrode comprises a metal nanoparticle sintered body, is formed inside a space surrounded by the first electrode and the wall, and is formed into a bathtub shape. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010278193(A) 申请公布日期 2010.12.09
申请号 JP20090128684 申请日期 2009.05.28
申请人 MURATA MFG CO LTD 发明人 YAMAMOTO TAKASHI;KOBAYASHI DAIGO
分类号 H01L21/60 主分类号 H01L21/60
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