| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a non-lead type mold package at low cost. SOLUTION: In Fig.2(b), half-blanking processing is carried out in a width including a center part of a common lead 12, i.e. a section bar 13 (common lead processing process). In Fig.2(d), a mold material 50 is formed on an upper surface on the structure, i.e. on the side, on which an electronic component 20 is mounted, on a metal pattern, and the electronic component 20 etc. is sealed (sealing process). In Fig.2(e), after the mold material 50 is solidified, a rotating blade (tooth) 60 of thickness E (E>D) is pressed from upper side in Fig.2(e) to cut the mold material 50 and a part of the common lead 12 (cutting process). In Fig.2(h), after a sheet 40 is peeled, it is easy to remove the mold material 50 which remains in the form of a thin layer, between right and left separated common leads 12 (separating process). COPYRIGHT: (C)2011,JPO&INPIT
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