| 摘要 |
PROBLEM TO BE SOLVED: To provide a mold resin molding which can narrow the separation interval of plate metallic conductors, can secure the uniformity of the separation interval of the plate metallic conductors, can prevent the occurrence of peeling in the adhesion interface between the plate metallic conductor and a resin for molds, and has an advantageous structure. SOLUTION: A plurality of the plate metallic conductors 2 and 3 are laminated at a constant separation interval of 500μm or below. By molding, the circumference of each plate metallic conductor is coated with an insulating adhesive resin composition having a melt viscosity of 50 Pa s or below, and the separation interval is filled with the resin composition 4, so that the plate metallic conductors 2 and 3 are separated electrically from each other, and the whole is laminated/unified to obtain the mold resin molding. In the mold resin molding, the respective opposed surface sides of the plurality of the plate metallic conductors 2 and 3 are made dull surfaces or rounded surfaces. COPYRIGHT: (C)2011,JPO&INPIT
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