| 摘要 |
Methods and systems for an on-chip leaky wave antenna (LWA) are disclosed and may include communicating RF signals using one or more LWAs in a wireless device. The LWAs may be integrated in metal layers in an integrated circuit (chip) in the wireless device. The RF signals may be communicated to devices external to the chip via a desired angle from the surface of the chip, or may be communicated between regions within the chip. The LWAs may comprise microstrip waveguides where a cavity height of the LWAs may be controlled by configuring a spacing between conductive lines in the microstrip waveguides. The LWAs may include coplanar waveguides where a cavity height of the leaky wave antennas may be controlled by configuring a spacing between conductive lines in the coplanar waveguides. The chip may be flip-chip-bonded to an integrated circuit package which may be affixed to a printed circuit board.
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