| 摘要 |
<P>PROBLEM TO BE SOLVED: To inspect mounting states of respective components mounted on a substrate including heights in a short time. <P>SOLUTION: A surface mounting device includes a substrate conveyance part 2 comprising an in buffer 12 where the substrate Sa having been carried in stands by, a center buffer 10 where the substrate carried in from the in buffer is positioned to mount components on the substrate, and an out buffer 14 where the substrate Sb mounted with the components at the center buffer stands by until it is carried out, and three-dimensional measuring instruments 20A, 20B, which measure the shape of the conveyed substrate are arranged at the in-buffer and out buffer, respectively. <P>COPYRIGHT: (C)2011,JPO&INPIT |
