| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lead frame type optical semiconductor package which achieves low thermal resistance. <P>SOLUTION: This optical semiconductor package 1 includes: a lead frame 13 including a metal piece 11 having an optical semiconductor element 22 mounted in a mounting region of a principal surface and electrically connected to the optical semiconductor element 22 by a conductive adhesive 24, and a metal piece 12 electrically connected to the optical semiconductor element 22 through a metal wire 26; a translucent member 16 formed of a translucent resin and arranged to cover the optical semiconductor element 22; and a light-blocking resin molded body 14 formed of a light-blocking resin and including a bottom part for supporting an inner lead part of the lead frame 13 and a side part for supporting the translucent member 16. In the optical semiconductor package, the back region of the metal piece 12 corresponding to the mounting region for mounting the optical semiconductor element 22 is made to penetrate the bottom part of the light-blocking resin molded body 14 to be exposed to the outside and used as a first heat radiation region. <P>COPYRIGHT: (C)2011,JPO&INPIT |
