| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a primer resin with excellent adhesiveness to metal foil having high surface smoothness, suppression of foaming when imidizing a polyamic acid, rust prevention effect on metal foil in imidization and solder heat resistance, being useful for a copper-clad laminate. <P>SOLUTION: The polyimide resin is a resin for a primer layer to secure adhesiveness between metal foil having high surface smoothness with surface roughness (Rz) of 2μm or less and an imide resin layer formed by a casting method, and is represented by formula (1) (in formula (1), R<SB>1</SB>comprises a tetravalent aromatic group having a phenyl ether skeleton; R<SB>2</SB>is a bivalent aromatic group comprising a phenyl ethers and aminophenols; and n is a repeating number). <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
