| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor module wherein heat dissipation is improved while degradation of insulation reliability is suppressed, and to provide a method of manufacturing the semiconductor module wherein a semiconductor module of superior heat dissipation can be manufactured while the insulation reliability is suppressed. <P>SOLUTION: The semiconductor module includes a heat spreader which is mounted with a semiconductor element on its upper surface side, and an insulating layer formed of a resin composition is bonded to the lower surface of the heat spreader, and a metal sheet layer formed of metal sheets is bonded to the lower surface of the insulating layer, and a resin mold covering the semiconductor element and the heat spreader is so applied as to expose the lower surface of the metal sheet layer. In the metal sheet layer, the insulating layer is so formed as to have an area smaller than the area covering the lower surface of the heat spreader, and arranged at the center portion of the lower surface of the heat spreader. The resin mold is bonded to the lower surface of the insulating layer on the outer side of the metal sheet layer, and covers the heat spreader from the lower surface side. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
