| 摘要 |
PROBLEM TO BE SOLVED: To provide a material for connecting circuit components which is prevented from being remelted or causing flush short, exhibits high adhesiveness in a high-temperature atmosphere and is excellent in wettability. SOLUTION: A thermosetting resin composition contains a thermosetting resin binder, metal powders and a flux component. The metal powders comprise first mixed metal powders and second mixed metal powders. The first mixed metal powders include first metal particles containing Ag, Bi, Cu, In and Sn by respectively predetermined amounts and second metal particles containing Ag, Bi, Cu, In and Sn by respectively predetermined amounts and have such a characteristic that an intermetallic compound is formed by thermal diffusion. The second mixed metal powders include third metal particles containing Ag, Bi, Cu, In and Sn by respectively predetermined amounts and fourth metal particles comprising Sn and have such the characteristic that the intermetallic compound is formed by thermal diffusion. At least one of the compounds shown by chemical formulae (1) and (2) is used as the flux component. COPYRIGHT: (C)2011,JPO&INPIT |
