发明名称 SUBSTRATE PROCESSING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To suppress a film thickness loss of an oxide film, which contains at least one of a rare earth oxide and an alkaline-earth oxide, when performing rinsing on a semiconductor substrate. SOLUTION: The oxide film, which contains at least one of a rare earth oxide and an alkaline-earth oxide, is formed on the semiconductor substrate (W). When performing rinsing on the semiconductor substrate (W), a rinse liquid made of an alkaline chemical or an organic solvent is used. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010287752(A) 申请公布日期 2010.12.24
申请号 JP20090140740 申请日期 2009.06.12
申请人 IMEC;DAINIPPON SCREEN MFG CO LTD 发明人 VOS RITA;MERTENS PAUL;SCHRAM TOM;WADA MASAYUKI
分类号 H01L21/304;B08B3/08;H01L21/306;H01L21/308;H01L21/8238;H01L27/092 主分类号 H01L21/304
代理机构 代理人
主权项
地址