发明名称 |
SUBSTRATE PROCESSING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To suppress a film thickness loss of an oxide film, which contains at least one of a rare earth oxide and an alkaline-earth oxide, when performing rinsing on a semiconductor substrate. SOLUTION: The oxide film, which contains at least one of a rare earth oxide and an alkaline-earth oxide, is formed on the semiconductor substrate (W). When performing rinsing on the semiconductor substrate (W), a rinse liquid made of an alkaline chemical or an organic solvent is used. COPYRIGHT: (C)2011,JPO&INPIT |
申请公布号 |
JP2010287752(A) |
申请公布日期 |
2010.12.24 |
申请号 |
JP20090140740 |
申请日期 |
2009.06.12 |
申请人 |
IMEC;DAINIPPON SCREEN MFG CO LTD |
发明人 |
VOS RITA;MERTENS PAUL;SCHRAM TOM;WADA MASAYUKI |
分类号 |
H01L21/304;B08B3/08;H01L21/306;H01L21/308;H01L21/8238;H01L27/092 |
主分类号 |
H01L21/304 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|