| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroless nickel plating bath and a plating method using the same capable of forming a plated film excellent in adhesiveness.SOLUTION: The electroless nickel plating bath is prepared by dissolving in 1 L of water, 110-130 g/L hypophosphorous acid, 98-120 g/L nickel sulfate, 45-60 g/L sodium acetate, 0.005-0.025 g/L lead nitrate, 0.003-0.023 g/L thiourea, 70-95 g/L malic acid, and 30-50 g/L caustic soda as a pH buffering agent. A nickel plated film is formed on the surface of an object to be plated by dipping the object in the electroless nickel plating bath whose pH is adjusted to 4.8-5.3. |
