| 摘要 |
PROBLEM TO BE SOLVED: To provide a module with a built-in component which can be produced without necessitating a via-forming process. SOLUTION: The module with a built-in component 100 has an insulating sheet substrate 10 which has an upper surface 10a, a lower surface 10b opposite to the upper surface and a side surface 10c which joins these surfaces; at least one wiring 20 which extends from the upper surface to the lower surface through the side surface; and electronic components 32 disposed within the sheet substrate. COPYRIGHT: (C)2005,JPO&NCIPI |
