发明名称 METHOD FOR PRODUCING BONDED MEMBER AND APPARATUS FOR PRODUCING BONDED MEMBER
摘要 PROBLEM TO BE SOLVED: To provide a method for producing a bonded member and an apparatus for producing a bonded member by which a liquid resin is spread into a member in just proportion while evading the mixture of gas. SOLUTION: The apparatus 1 for producing a bonded member includes a liquid resin applying device 21 applying a liquid resin G on a coating face Df, a positioning device and approximating device 10 allowing the coating face Df to oppose to and approach a bonding face Pf, and a thickening means 41 subjecting the liquid resin G near a corner of a first member D to a thickening process. The liquid resin applying device 21 applies the liquid resin G to the coating face Df so as to form a main part Gm and a guidance part Gb, allowing the liquid resin G to reach the corner of a polygonal first member D. After the liquid resin G is applied, the coating face Df and the bonding face Pf are made nearer to each other to spread the liquid resin G; and when the spread liquid resin G reaches the vicinity of the corner of the first member D, the liquid resin G is subjected to the thickening process, and thereby the liquid resin G near the corner is suppressed from spreading and protruding. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011022508(A) 申请公布日期 2011.02.03
申请号 JP20090169368 申请日期 2009.07.17
申请人 ORIGIN ELECTRIC CO LTD 发明人 OKAJI HIDEYUKI
分类号 G09F9/00;B05C9/12;B05C11/02;G02F1/1333 主分类号 G09F9/00
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