发明名称 METHOD OF WELDING ULTRA THIN SHEET BY SEMICONDUCTOR LASER AND ULTRA HIGH-SPEED LASER MICRO WELDING APPARATUS BY THE SEMICONDUCTOR LASER
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an ultra thin sheet welding method by semiconductor laser in which a synthetic beam is formed by space coupling of combining a plurality of basic beams and by forming an irradiation beam adaptable to a joining shape of the surface to be welded of an ultra thin metallic sheet, and also to provide an ultra high-speed laser micro welding apparatus related to the method. <P>SOLUTION: The elliptical beams L1, L2, L3 having an identical wavelength, a beam width 0.05-0.3 mm and a beam length 0.3-1.5 mm oscillated from at least three sets of ultra small semiconductor lasers LD1, LD2, LD3 are combined by space coupling SC to form synthetic beams LO1, LO2, LO3, with ultra high-speed welding performed on an ultra thin metallic sheet of 100-10μm. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011020174(A) 申请公布日期 2011.02.03
申请号 JP20090182854 申请日期 2009.07.14
申请人 MA TECH KK;OSAKA UNIV 发明人 ABE NOBUYUKI;MURAKAMI KUNIO;AKAZAWA MASAMICHI
分类号 B23K26/32;B23K26/06 主分类号 B23K26/32
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