| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a film deposition system where the uniformity of a temperature distribution in the body to be treated is reduced, and the film thickness distribution of the film to be deposited on the body to be treated can be made uniform. <P>SOLUTION: The film deposition system 1 is at least provided with: a vacuum chamber 3 having an evacuation means 2; a supporting means 5 holding the body 4 to be treated each disposed at the inside of the vacuum chamber; a film deposition mens arranged so as to be confronted with the supporting means, discharging a raw material gas onto the body 4 to be treated and depositing a film on the body to be treated; a cylindrical first plate 6 disposed so as to surround the supporting means and having an opening part to the direction of the supporting means; and a second plate 2 disposed so as to surround the supporting means in the outside than the first plate. The first plate is movable between a first state located between the supporting means and the second plate and a second state located so as to surround the first space between the supporting means and the film deposition means. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
