| 摘要 |
PROBLEM TO BE SOLVED: To provide a cutting groove detection device capable of detecting a cutting groove formed in a wafer through dicing tape from the back side, and to provide a cutting machine with the device. SOLUTION: The device detects the cutting groove, which is formed in a wafer adhered to the surface side of dicing tape mounted on an annular frame by a cutting blade, through dicing tape; comprising an imaging camera, an objective lens holding tube that holds an objective lens arranged on the optical axis of the imaging camera, an imaging means with a water layer forming means that forms a water layer between an object mounted on the upper end of the objective lens holding tube and the imaging means, and a display means that displays an image photographed by the imaging camera of the imaging means. COPYRIGHT: (C)2011,JPO&INPIT |
